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1 Ergebnisse
1
3D Cryogenic Interposer for Quantum Computing Application:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Li, Hongyu
;
Lau, Aaron Chit Siong
;
Jaafar, Norhanani
... - p. 1546-1550 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00246
RT T1
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
: T1
3D Cryogenic Interposer for Quantum Computing Application
UL https://suche.suub.uni-bremen.de/peid=ieee-9816641&Exemplar=1&LAN=DE A1 Li, Hongyu A1 Lau, Aaron Chit Siong A1 Jaafar, Norhanani A1 Lee, Rainer Cheow Siong A1 Wong, Calvin Pei Yu A1 Goh, Kuan Eng Johnson A1 Chui, King-Jien YR 2022 SN 2377-5726 K1 Three-dimensional displays K1 Quantum computing K1 Metals K1 Electronic components K1 Cryogenics K1 Silicon K1 Reliability K1 component K1 TSV K1 cryogenic temperature K1 superconducting A1 SP 1546 OP 1550 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00246 DO https://doi.org/10.1109/ECTC51906.2022.00246 SF ELIB - SuUB Bremen
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