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3D Cryogenic Interposer for Quantum Computing Application:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Li, Hongyu ; Lau, Aaron Chit Siong ; Jaafar, Norhanani... - p. 1546-1550 , 2022
Link: https://doi.org/10.1109/ECTC51906.2022.00246