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1 Ergebnisse
1
The Influence of Cu Microstructure on Thermal Budget in Hyb..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Mirkarimi, Laura
;
Uzoh, Cyprian
;
Suwito, Dominik
... - p. 162-167 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00036
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816643&Exemplar=1&LAN=DE A1 Mirkarimi, Laura A1 Uzoh, Cyprian A1 Suwito, Dominik A1 Lee, Bongsub A1 Fountain, Gill A1 Workman, Thomas A1 Theil, Jeremy A1 Gao, Guilian A1 Buckalew, Bryan A1 Oberst, Justin A1 Ponnuswamy, Thomas YR 2022 SN 2377-5726 K1 Temperature measurement K1 Temperature sensors K1 Scanning electron microscopy K1 Temperature distribution K1 Annealing K1 Thermal engineering K1 Surfaces K1 Cu-Cu hybrid bonding K1 direct bond interconnect (DBI) K1 DBI Ultra K1 hybrid bonding K1 D2W K1 D2D K1 Cu electrodeposition K1 fine grain Cu K1 nanotwin Cu K1 dicing K1 die-on-tape processing SP 162 OP 167 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00036 DO https://doi.org/10.1109/ECTC51906.2022.00036 SF ELIB - SuUB Bremen
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