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Laser Direct Structuring of Semiconductor Liquid Encapsulan..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),

He, Chunlin ; DeWit, Ruud ; Chao, Jay... - p. 1277-1281 , 2022

Link: https://doi.org/10.1109/ECTC51906.2022.00205

RT 
T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Laser Direct Structuring of Semiconductor Liquid Encapsulants for Active Mold Packaging</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-9816644&Exemplar=1&LAN=DE
				
A1 He, Chunlin
A1 DeWit, Ruud
A1 Chao, Jay
A1 Champagne, Tim
A1 Guino, Rose
A1 Winster, Tony
A1 Trichur, Ramachandran
A1 Saliba, Mario
A1 Song, Frank
A1 Roick, Florian
A1 Heitmann, Simon
A1 Roesener, Bernd
A1 Stelling, Johan
YR 2022
SN 2377-5726
K1 Radio frequency
K1 Encapsulation
K1 Printing
K1 Technological innovation
K1 Liquids
K1 Semiconductor lasers
K1 Wires
K1 Laser Direct Structuring
K1 Liquid Mold Compound
K1 Liquid Compression Molding
K1 Liquid Encapsulants
K1 Stencil Printing
K1 Active Mold Packaging
K1 Metal Plating
K1 Copper Plating
K1 Mobile RF Antenna
K1 Antenna-in-Package
K1 System-in-Package
SP 1277
OP 1281
LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00205
DO https://doi.org/10.1109/ECTC51906.2022.00205
SF ELIB - SuUB Bremen

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