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1 Ergebnisse
1
Embedded-IC package using Si-interposer for mmWave Applicat..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Lee, Hyun-Beom
;
Kim, Young-Gon
;
Kim, Wansik
... - p. 2050-2057 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00323
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Embedded-IC package using Si-interposer for mmWave Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816647&Exemplar=1&LAN=DE A1 Lee, Hyun-Beom A1 Kim, Young-Gon A1 Kim, Wansik A1 Kim, Sosu A1 Min, Byung-Wook A1 Yook, Jong-Min YR 2022 SN 2377-5726 K1 Degradation K1 Analytical models K1 Integrated circuit interconnections K1 Insertion loss K1 Insulators K1 Transmission line measurements K1 Loss measurement K1 Si–embedded IC package K1 SiP K1 interconnection K1 W-band application K1 parasitic resonances SP 2050 OP 2057 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00323 DO https://doi.org/10.1109/ECTC51906.2022.00323 SF ELIB - SuUB Bremen
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