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Demonstration of Glass-based 3D Package Architectures with ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Ravichandran, Siddharth ; Smet, Vanessa ; Swaminathan, Madhavan. - p. 1114-1120 , 2022
Link: https://doi.org/10.1109/ECTC51906.2022.00180