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1 Ergebnisse
1
Study of Failure and Microstructural Evolution in SAC Solde..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Ram Kim, Yi
;
Osmanson, Allison T.
;
Kim, Choong-Un
.. - p. 1153-1157 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00186
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Study of Failure and Microstructural Evolution in SAC Solder Interconnects Induced by AC Electromigration Condition</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816669&Exemplar=1&LAN=DE A1 Ram Kim, Yi A1 Osmanson, Allison T. A1 Kim, Choong-Un A1 Thompson, Patrick F. A1 Chen, Qiao YR 2022 SN 2377-5726 K1 Electromigration K1 Heating systems K1 Temperature K1 Fluctuations K1 Integrated circuit interconnections K1 Bidirectional control K1 Microstructure K1 Alternating current (AC) K1 Electromigration (EM) K1 Intermetallic compound (IMC) SP 1153 OP 1157 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00186 DO https://doi.org/10.1109/ECTC51906.2022.00186 SF ELIB - SuUB Bremen
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