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1 Ergebnisse
1
A Novel Packaging Platform for High-Performance Optical Eng..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Gourikutty, Sajay Bhuvanendran Nair
;
Jong, Ming Chinq
;
Kanna, Chockanathan Vinoth
... - p. 422-427 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00074
RT T1
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
: T1
A Novel Packaging Platform for High-Performance Optical Engines in Hyperscale Data Center Applications
UL https://suche.suub.uni-bremen.de/peid=ieee-9816672&Exemplar=1&LAN=DE A1 Gourikutty, Sajay Bhuvanendran Nair A1 Jong, Ming Chinq A1 Kanna, Chockanathan Vinoth A1 Ho, David Soon Wee A1 Wei, Seit Wen A1 Siang, Sharon Lim Pei A1 Wu, Jiaqi A1 Lim, Teck Guan A1 Mandal, Rathin A1 Liow, Jason Tsung-Yang A1 Bhattacharya, Surya YR 2022 SN 2377-5726 K1 Integrated optics K1 Data centers K1 Optical interconnections K1 Packaging K1 Optical coupling K1 Transceivers K1 Wafer scale integration K1 Hyperscale Data Centers K1 High-performance computing K1 Electronic Photonic Package K1 Heterogeneous Integration K1 Optical Transceivers K1 Optical Engine K1 Fan-out wafer-level packaging SP 422 OP 427 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00074 DO https://doi.org/10.1109/ECTC51906.2022.00074 SF ELIB - SuUB Bremen
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