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1 Ergebnisse
1
Advanced Fanout Packaging Technology for Hybrid Substrate I..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Cao, Lihong
;
Lee, Teck Chong
;
Chen, Rick
... - p. 1362-1370 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00219
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Advanced Fanout Packaging Technology for Hybrid Substrate Integration</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816673&Exemplar=1&LAN=DE A1 Cao, Lihong A1 Lee, Teck Chong A1 Chen, Rick A1 Chang, Yung-Shun A1 Lu, Hsingfu A1 Chao, Nicholas A1 Huang, Yen-Liang A1 Wang, Chen-Chao A1 Huang, Chih-Yi A1 Kuo, Hung-Chun A1 Wu, YiHsien A1 Cheng, Hung-Hsiang YR 2022 SN 2377-5726 K1 Costs K1 Three-dimensional displays K1 Packaging K1 Routing K1 Laminates K1 Artificial intelligence K1 Through-silicon vias K1 High density Fanout (FO) on substrate K1 FOBGA K1 FCBGA K1 RDL K1 Warpage K1 Signal integrity K1 Power integrity K1 Electrical simulation SP 1362 OP 1370 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00219 DO https://doi.org/10.1109/ECTC51906.2022.00219 SF ELIB - SuUB Bremen
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