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1 Ergebnisse
1
Low cost copper based sintered interconnect material for op..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Bhogaraju, Sri Krishna
;
Schmid, Maximilian
;
Liu, E
... - p. 1720-1725 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00270
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Low cost copper based sintered interconnect material for optoelectronics packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816675&Exemplar=1&LAN=DE A1 Bhogaraju, Sri Krishna A1 Schmid, Maximilian A1 Liu, E A1 Saccon, Rodolfo A1 Elger, Gordon A1 Klassen, Holger A1 Muller, Klaus A1 Pirzer, Georg YR 2022 SN 2377-5726 K1 Degradation K1 Spectroscopy K1 Temperature K1 Thermomechanical processes K1 Stacking K1 Sintering K1 Packaging K1 Cu sintering K1 flakes K1 PEG600 K1 reliability K1 encapsulation K1 oxidation K1 transient thermal analysis K1 Scanning acoustic microscopy K1 μ-Raman spectroscopy SP 1720 OP 1725 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00270 DO https://doi.org/10.1109/ECTC51906.2022.00270 SF ELIB - SuUB Bremen
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