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1 Ergebnisse
1
Mini LED array transferred onto a flexible substrate using ..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Joo, Jiho
;
Choi, Gwang-Mun
;
Lee, Chanmi
... - p. 619-624 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00104
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Mini LED array transferred onto a flexible substrate using Simultaneous Transfer and Bonding (SITRAB) process and Anisotropic Solder Film (ASF)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816688&Exemplar=1&LAN=DE A1 Joo, Jiho A1 Choi, Gwang-Mun A1 Lee, Chanmi A1 Eom, Yong-Sung A1 Kye, In-Seok A1 Jang, Ki-Seok A1 Hwang, Seok Tae A1 Duck Kim, Jeong A1 Choi, Kwang-Seong YR 2022 SN 2377-5726 K1 Degradation K1 Scanning electron microscopy K1 Powders K1 Microscopy K1 Glass K1 Bending K1 Light emitting diodes K1 Micro-LED display K1 Mini-LED display K1 Transfer technology K1 Simultaneous transfer and bonding K1 SITRAB K1 Anisotropic solder film K1 ASF K1 Flexible substrate SP 619 OP 624 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00104 DO https://doi.org/10.1109/ECTC51906.2022.00104 SF ELIB - SuUB Bremen
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