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1
Modeling of Spreading Behavior of UV-Curable Dielectric Ink..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Kang, Sujie
;
Lee, Jung Shin
;
Woo Cho, Jung
... - p. 774-779 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00128
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Modeling of Spreading Behavior of UV-Curable Dielectric Ink from its Rheological Characteristics</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816689&Exemplar=1&LAN=DE A1 Kang, Sujie A1 Lee, Jung Shin A1 Woo Cho, Jung A1 Park, Sun Woo A1 Lee, Seungdon A1 Lee, Hyunjin A1 Rhee, Daniel Minwoo YR 2022 SN 2377-5726 K1 Viscosity K1 Temperature measurement K1 Analytical models K1 Three-dimensional displays K1 Liquids K1 Time measurement K1 Behavioral sciences K1 advanced packaging K1 additive manufacturing K1 inkjet printing K1 redistribution layer K1 photo-imageable dielectric SP 774 OP 779 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00128 DO https://doi.org/10.1109/ECTC51906.2022.00128 SF ELIB - SuUB Bremen
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