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1 Ergebnisse
1
Co-design and Signal-Power Integrity/EMI Co-analysis of a S..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Miao, Min
;
Duan, Xiaolong
;
Sun, Liang
... - p. 1329-1336 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00214
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Co-design and Signal-Power Integrity/EMI Co-analysis of a Switchable High-speed Inter-Chiplet Serial Link on an Active Interposer</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816691&Exemplar=1&LAN=DE A1 Miao, Min A1 Duan, Xiaolong A1 Sun, Liang A1 Li, Tao A1 Zhu, Shiliang A1 Zhang, Zhuanzhuan A1 Li, Jin A1 Zhang, Danya A1 Wen, Hao A1 Liu, Xuena A1 Li, Zhensong YR 2022 SN 2377-5726 K1 Electromagnetic interference K1 Prototypes K1 Switches K1 Network-on-chip K1 Fabrics K1 Silicon K1 Foundries K1 chiplet K1 active interposer K1 net-on-chip (NoC) K1 signal integrity K1 power integrity K1 electromagnetic interference K1 co-design K1 co-simulation K1 Domain-Specific Architecture (DSA) SP 1329 OP 1336 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00214 DO https://doi.org/10.1109/ECTC51906.2022.00214 SF ELIB - SuUB Bremen
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