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1 Ergebnisse
1
Laser soldered wire bonding on liquid printed and sputtered..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Fettke, Matthias
;
Kubsch, Timo
;
Fisch, Anne
... - p. 1430-1441 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00229
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Laser soldered wire bonding on liquid printed and sputtered contact structures on thin-flexes and injection molded devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816698&Exemplar=1&LAN=DE A1 Fettke, Matthias A1 Kubsch, Timo A1 Fisch, Anne A1 Baa, Mohammed Ziad A1 Teutsch, Thorsten A1 Seifert, Tobias A1 Baum, Mario A1 Selbmann, Franz A1 Paul, Soumya Deep A1 Roscher, Frank A1 Kreyssig, Kerstin A1 Wiemer, Maik A1 Kuhn, Harald YR 2022 SN 2377-5726 K1 Printing K1 Gold K1 Optical microscopy K1 Semiconductor lasers K1 Wires K1 X-ray lasers K1 Laser stability K1 wire-bonding K1 wire-soldering K1 molded device K1 ink K1 paste K1 printing K1 screen-printing K1 jetting K1 laser-reflow K1 nano K1 flex K1 film SP 1430 OP 1441 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00229 DO https://doi.org/10.1109/ECTC51906.2022.00229 SF ELIB - SuUB Bremen
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