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1 Ergebnisse
1
A Novel Quantitative Adhesion Measurement Method for Thin P..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Woehrmann, Markus
;
Mackowiak, Piotr
;
Schiffer, Michael
.. - p. 754-761 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00125
RT T1
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
: T1
A Novel Quantitative Adhesion Measurement Method for Thin Polymer and Metal Layers for Microelectronic Applications
UL https://suche.suub.uni-bremen.de/peid=ieee-9816699&Exemplar=1&LAN=DE A1 Woehrmann, Markus A1 Mackowiak, Piotr A1 Schiffer, Michael A1 Lang, Klaus-Dieter A1 Schneider-Ramelow, Martin YR 2022 SN 2377-5726 K1 Temperature measurement K1 Adhesives K1 Energy measurement K1 Production K1 Packaging K1 Finite element analysis K1 Polymers K1 fracture toughness K1 adhesion measurement K1 RDL K1 reliability K1 strain energy K1 energy release rate K1 mELT K1 FEM K1 SLT SP 754 OP 761 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00125 DO https://doi.org/10.1109/ECTC51906.2022.00125 SF ELIB - SuUB Bremen
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