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1 Ergebnisse
1
Warpage and RDL Stress Analysis in Large Fan-Out Package wi..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Wong, Jen-Hsien
;
Wu, NanYi
;
Lai, Wei-Hong
... - p. 1074-1079 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00173
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Warpage and RDL Stress Analysis in Large Fan-Out Package with Multi-Chiplet Integration</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816702&Exemplar=1&LAN=DE A1 Wong, Jen-Hsien A1 Wu, NanYi A1 Lai, Wei-Hong A1 Chen, Dao-Long A1 Chen, Tang-Yuan A1 Chen, Chung-Hao A1 Wu, Yi-Hsien A1 Chang, Yung-shun A1 Kao, Chin-Li A1 Tarng, David A1 Chong Lee, Teck A1 Hung, CP YR 2022 SN 2377-5726 K1 Industries K1 Layout K1 Time to market K1 Switches K1 Packaging K1 Silicon K1 Device-to-device communication K1 Multi-Chiplets integration K1 FOCoS K1 Warpage K1 stress K1 RDL (Re-Distribution Layer) K1 D2D gap (die to die gap) SP 1074 OP 1079 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00173 DO https://doi.org/10.1109/ECTC51906.2022.00173 SF ELIB - SuUB Bremen
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