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1 Ergebnisse
1
Analysis of Die Edge Bond Pads in Hybrid Bonded Multi-Die S..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Theil, Jeremy A.
;
Workman, Thomas
;
Suwito, Dominik
... - p. 130-136 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00031
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Analysis of Die Edge Bond Pads in Hybrid Bonded Multi-Die Stacks</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816704&Exemplar=1&LAN=DE A1 Theil, Jeremy A. A1 Workman, Thomas A1 Suwito, Dominik A1 Mirkarimi, Laura A1 Fountain, Gill A1 Bang, KM A1 Gao, Guilian A1 Lee, Bongsub A1 Mrozek, Pawel A1 Uzoh, Cyprian A1 Huynh, Michael A1 Zhao, Oliver YR 2022 SN 2377-5726 K1 Resistance K1 Temperature measurement K1 Performance evaluation K1 Scanning electron microscopy K1 Stacking K1 Throughput K1 Arrays K1 Cu-Cu hybrid bonding K1 design guidelines K1 die edge K1 direct bond interconnect (DBI) K1 DBI Ultra K1 hybrid bonding K1 D2W K1 3D-IC K1 diestacking K1 reliability SP 130 OP 136 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00031 DO https://doi.org/10.1109/ECTC51906.2022.00031 SF ELIB - SuUB Bremen
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