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1 Ergebnisse
1
A Deep Learning Approach for Reflow Profile Prediction:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Lai, Yangyang
;
Kataoka, Jun
;
Pan, Ke
... - p. 2269-2274 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00358
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Deep Learning Approach for Reflow Profile Prediction</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816709&Exemplar=1&LAN=DE A1 Lai, Yangyang A1 Kataoka, Jun A1 Pan, Ke A1 Ha, Jonghwan A1 Yang, Junbo A1 Deo, Karthik A A1 Xu, Jiefeng A1 Yin, Pengcheng A1 Cai, Chongyang A1 Park, Seungbae YR 2022 SN 2377-5726 K1 Temperature measurement K1 Semiconductor device modeling K1 Deep learning K1 Heating systems K1 Ovens K1 Computational modeling K1 Neural networks K1 Surface-mount technology K1 reflow soldering process K1 computational fluid dynamics (CFD) K1 convolutional neural network (CNN) K1 long short-term memory (LSTM) SP 2269 OP 2274 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00358 DO https://doi.org/10.1109/ECTC51906.2022.00358 SF ELIB - SuUB Bremen
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