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An extensive simulation study of the interfacial delaminati..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Lyu, Guang-Chao
;
Wang, Hong-Guang
;
Zhou, Min-Bo
. - p. 1614-1623 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00257
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>An extensive simulation study of the interfacial delamination in molded underfill flip-chip packages by finite element method based on virtual crack closure technique</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816720&Exemplar=1&LAN=DE A1 Lyu, Guang-Chao A1 Wang, Hong-Guang A1 Zhou, Min-Bo A1 Zhang, Xin-Ping YR 2022 SN 2377-5726 K1 Shape K1 Simulation K1 Force K1 Silicon K1 Finite element analysis K1 Flip-chip devices K1 Delamination K1 Flip-chip package K1 molded underfill K1 interfacial delamination K1 virtual crack closure technique K1 strain energy release rate K1 phase angle SP 1614 OP 1623 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00257 DO https://doi.org/10.1109/ECTC51906.2022.00257 SF ELIB - SuUB Bremen
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