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1 Ergebnisse
1
High Performance and Energy Efficient Computing with Advanc..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Liang, S. W.
;
Wu, Gene C. Y.
;
Yee, K. C.
... - p. 1090-1094 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00176
RT T1
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
: T1
High Performance and Energy Efficient Computing with Advanced SoIC™ Scaling
UL https://suche.suub.uni-bremen.de/peid=ieee-9816724&Exemplar=1&LAN=DE A1 Liang, S. W. A1 Wu, Gene C. Y. A1 Yee, K. C. A1 Wang, C. T. A1 Cui, Ji James A1 Yu, Douglas C. H. YR 2022 SN 2377-5726 K1 Technological innovation K1 Three-dimensional displays K1 Stacking K1 Semiconductor device reliability K1 Process control K1 Bandwidth K1 System integration K1 system integration K1 chiplets K1 high performance computing (HPC) K1 EEP K1 3DFabricTM K1 chip-on-wafer K1 SoIC™ SP 1090 OP 1094 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00176 DO https://doi.org/10.1109/ECTC51906.2022.00176 SF ELIB - SuUB Bremen
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