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1 Ergebnisse
1
Extreme Low-Temperature High Strain-Rate Constitutive Behav..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Lall, Pradeep
;
Mehta, Vishal
;
Yadav, Vikas
... - p. 1646-1657 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00261
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Extreme Low-Temperature High Strain-Rate Constitutive Behavior Evolution of Doped and Undoped Leadfree Solders under Sustained High Temperature Exposure</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816739&Exemplar=1&LAN=DE A1 Lall, Pradeep A1 Mehta, Vishal A1 Yadav, Vikas A1 Saha, Mrinmoy A1 Suhling, Jeff A1 Locker, Dave YR 2022 SN 2377-5726 K1 Temperature measurement K1 Temperature distribution K1 Electric shock K1 Computational modeling K1 Predictive models K1 Lead K1 Data models K1 Lead-Free Solders K1 SAC305 K1 SAC-Q K1 M758 K1 SAC-R K1 High Strain Rates K1 Anand Viscoplastic Model K1 FE analysis for drop/shock SP 1646 OP 1657 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00261 DO https://doi.org/10.1109/ECTC51906.2022.00261 SF ELIB - SuUB Bremen
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