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1 Ergebnisse
1
First demonstration of Two Metal Level Semi-damascene Inter..:
, In:
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
,
Murdoch, G.
;
O'Toole, M.
;
Marti, G.
... - p. 1-2 , 2022
Link:
https://doi.org/10.1109/VLSITechnologyandCir46769.2022..
RT T1 <cTitle>2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)</cTitle>: T1 <Title>First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9830150&Exemplar=1&LAN=DE A1 Murdoch, G. A1 O'Toole, M. A1 Marti, G. A1 Pokhrel, A. A1 Tsvetanova, D. A1 Decoster, S. A1 Kundu, S. A1 Oniki, Y. A1 Thiam, A. A1 Le, Q.T. A1 Varela Pedreira, O. A1 Lesniewska, A. A1 Martinez-Alanis, G. A1 Park, S. A1 Tokei, Zs. YR 2022 SN 2158-9682 K1 Electric breakdown K1 Metals K1 Integrated circuit interconnections K1 Very large scale integration K1 Etching K1 Interconnect K1 Ruthenium K1 semi-damascene K1 fully self-aligned via SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830150 DO https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830150 SF ELIB - SuUB Bremen
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