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1 Ergebnisse
1
Backside PDN and 2.5D MIMCAP to Double Boost 2D and 3D ICs ..:
, In:
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
,
Chen, R.
;
Sisto, G.
;
Stucchi, M.
... - p. 429-430 , 2022
Link:
https://doi.org/10.1109/VLSITechnologyandCir46769.2022..
RT T1 <cTitle>2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)</cTitle>: T1 <Title>Backside PDN and 2.5D MIMCAP to Double Boost 2D and 3D ICs IR-Drop beyond 2nm Node</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9830328&Exemplar=1&LAN=DE A1 Chen, R. A1 Sisto, G. A1 Stucchi, M. A1 Jourdain, A. A1 Miyaguchi, K. A1 Schuddinck, P. A1 Woeltgens, P. A1 Lin, H. A1 Kakarla, N. A1 Veloso, A. A1 Milojevic, D. A1 Zografos, O. A1 Weckx, P. A1 Hellings, G. A1 Van Der Plas, G. A1 Ryckaert, J. A1 Beyne, E. YR 2022 SN 2158-9682 K1 Adaptation models K1 Solid modeling K1 Three-dimensional displays K1 Metals K1 Color K1 Very large scale integration K1 System-on-chip SP 429 OP 430 LK http://dx.doi.org/https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830328 DO https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830328 SF ELIB - SuUB Bremen
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