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1 Ergebnisse
1
Wafer-Scale Bi-Assisted Semi-Auto Dry Transfer and Fabricat..:
, In:
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
,
Li, Ming-Yang
;
Hsu, Ching-Hao
;
Shen, Shin-Wei
... - p. 290-291 , 2022
Link:
https://doi.org/10.1109/VLSITechnologyandCir46769.2022..
RT T1 <cTitle>2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)</cTitle>: T1 <Title>Wafer-Scale Bi-Assisted Semi-Auto Dry Transfer and Fabrication of High-Performance Monolayer CVD WS2 Transistor</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9830376&Exemplar=1&LAN=DE A1 Li, Ming-Yang A1 Hsu, Ching-Hao A1 Shen, Shin-Wei A1 Chou, Ang-Sheng A1 Lin, Yuxuan Cosmi A1 Chuu, Chih-Piao A1 Yang, Ning A1 Chou, Sui-An A1 Huang, Lin-Yun A1 Cheng, Chao-Ching A1 Woon, Wei-Yen A1 Liao, Szuya A1 Wu, Chih-I A1 Li, Lain-Jong A1 Radu, Iuliana A1 Wong, H.-S. Philip A1 Wang, Han YR 2022 SN 2158-9682 K1 Fabrication K1 Two dimensional displays K1 Very large scale integration K1 Contact resistance K1 Transistors SP 290 OP 291 LK http://dx.doi.org/https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830376 DO https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830376 SF ELIB - SuUB Bremen
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