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1 Ergebnisse
1
A Wafer Scale Hybrid Integration Platform for Co-packaged P..:
, In:
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
,
Venkatesan, Suresh
;
Lee, James
;
Kiat Goh, Simon Chun
... - p. 381-382 , 2022
Link:
https://doi.org/10.1109/VLSITechnologyandCir46769.2022..
RT T1 <cTitle>2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)</cTitle>: T1 <Title>A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical InterposerTM</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9830432&Exemplar=1&LAN=DE A1 Venkatesan, Suresh A1 Lee, James A1 Kiat Goh, Simon Chun A1 Pile, Brian A1 Meerovich, Daniel A1 Mo, Jinyu A1 Jing, Yang A1 Soldano, Lucas A1 Xu, Baochang A1 Zhang, Yu A1 Yew Thean, Aaron Voon A1 Kheng Lim, Yeow YR 2022 SN 2158-9682 K1 Integrated optics K1 Industries K1 Lasers K1 Very large scale integration K1 CMOS technology K1 Optical modulation K1 Flip-chip devices SP 381 OP 382 LK http://dx.doi.org/https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830432 DO https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830432 SF ELIB - SuUB Bremen
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