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1 Ergebnisse
1
300 mm MOCVD 2D CMOS Materials for More (Than) Moore Scalin:
, In:
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
,
Maxey, K.
;
Naylor, C. H.
;
O'Brien, K. P.
... - p. 419-420 , 2022
Link:
https://doi.org/10.1109/VLSITechnologyandCir46769.2022..
RT T1 <cTitle>2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)</cTitle>: T1 <Title>300 mm MOCVD 2D CMOS Materials for More (Than) Moore Scaling</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9830457&Exemplar=1&LAN=DE A1 Maxey, K. A1 Naylor, C. H. A1 O'Brien, K. P. A1 Penumatcha, A. A1 Oni, A. A1 Mokhtarzadeh, C. A1 Dorow, C. J. A1 Rogan, C. A1 Holybee, B. A1 Tronic, T. A1 Adams, D. A1 Arefin, N. A1 Sen Gupta, A. A1 Lin, C.-C. A1 Zhong, T. A1 Lee, S. A1 Kitamura, A. A1 Bristol, R. A1 Clendenning, S. B. A1 Avci, U. A1 Metz, M. YR 2022 SN 2158-9682 K1 Grain size K1 Field effect transistors K1 Very large scale integration K1 CMOS technology K1 Silicon K1 Sulfur K1 MOCVD K1 2D CMOS K1 TMD K1 300 mm K1 2D FET SP 419 OP 420 LK http://dx.doi.org/https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830457 DO https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830457 SF ELIB - SuUB Bremen
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