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1 Ergebnisse
1
A Simple Method for Fine Vertical Interconnection by Stenci..:
, In:
2022 China Semiconductor Technology International Conference (CSTIC)
,
Xiang, Xun
;
Li, Zibai
;
Zeng, Hongjian
... - p. 1-3 , 2022
Link:
https://doi.org/10.1109/CSTIC55103.2022.9856735
RT T1 <cTitle>2022 China Semiconductor Technology International Conference (CSTIC)</cTitle>: T1 <Title>A Simple Method for Fine Vertical Interconnection by Stencil Printed Vias on Flexible Printed Circuit Board with Low Temperature Sintering Nano-Silver Paste</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9856735&Exemplar=1&LAN=DE A1 Xiang, Xun A1 Li, Zibai A1 Zeng, Hongjian A1 Zheng, Wei A1 Hu, Chuan A1 Wang, Yao YR 2022 K1 Resistance K1 Printing K1 Silver K1 Flexible printed circuits K1 Integrated circuit interconnections K1 Sintering K1 Packaging SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC55103.2022.9856735 DO https://doi.org/10.1109/CSTIC55103.2022.9856735 SF ELIB - SuUB Bremen
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