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1 Ergebnisse
1
300 MM Wafer Laser Anneal Process Development for Applicati..:
, In:
2022 China Semiconductor Technology International Conference (CSTIC)
,
Kang, Xiaoxu
;
Huang, Yuanhao
;
Luo, Wen
... - p. 1-3 , 2022
Link:
https://doi.org/10.1109/CSTIC55103.2022.9856830
RT T1 <cTitle>2022 China Semiconductor Technology International Conference (CSTIC)</cTitle>: T1 <Title>300 MM Wafer Laser Anneal Process Development for Applications of Multiple Process Condition in Different Zones on Single Wafer</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9856830&Exemplar=1&LAN=DE A1 Kang, Xiaoxu A1 Huang, Yuanhao A1 Luo, Wen A1 Liu, Jianrui A1 Chu, Zhenghui A1 Zhong, Xiaolan A1 Zhang, Min A1 Zhou, Xiaoqiang A1 Zang, Kaiyan A1 Li, Ming A1 Zhu, Limin A1 Lu, Hanwei A1 Zhang, Bo YR 2022 K1 Semiconductor device measurement K1 Rapid thermal annealing K1 Rapid thermal processing K1 Power measurement K1 Surface resistance K1 Measurement by laser beam K1 Surface emitting lasers SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC55103.2022.9856830 DO https://doi.org/10.1109/CSTIC55103.2022.9856830 SF ELIB - SuUB Bremen
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