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1 Ergebnisse
1
SADP etch process development using PR core for sub 17nm DR..:
, In:
2022 China Semiconductor Technology International Conference (CSTIC)
,
Xu, Li Tian
;
Zhang, Shuai
;
Li, Ling Feng
... - p. 1-3 , 2022
Link:
https://doi.org/10.1109/CSTIC55103.2022.9856835
RT T1
2022 China Semiconductor Technology International Conference (CSTIC)
: T1
SADP etch process development using PR core for sub 17nm DRAM
UL https://suche.suub.uni-bremen.de/peid=ieee-9856835&Exemplar=1&LAN=DE A1 Xu, Li Tian A1 Zhang, Shuai A1 Li, Ling Feng A1 Liu, Hao A1 Huang, Xin Wen A1 Chen, Ying Yi A1 Su, Xian Wen A1 Guo, Zhong Ning A1 Xiu, Chun Yu A1 Mu, Tian Lei A1 Lin, Bing Hui A1 He, Zhong Yi A1 Zhou, Qing Jun YR 2022 K1 Silicon compounds K1 Legged locomotion K1 Compressive stress K1 Shape K1 Lithography K1 Random access memory K1 Etching K1 spacer-defined double patterning K1 self-aligned double patterning K1 resist mandrel K1 resist core K1 oxide spacer K1 ALD SiO2 K1 compressive stress K1 wiggling K1 leaning K1 carbon hard mask K1 buried word line K1 pitch walking K1 DRAM K1 NMC612E SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC55103.2022.9856835 DO https://doi.org/10.1109/CSTIC55103.2022.9856835 SF ELIB - SuUB Bremen
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