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A Wafer-on-Wafer Non-Uniform High Power Thermal Model for 3..:

, In: 2022 China Semiconductor Technology International Conference (CSTIC),
Wang, Song ; Jiang, Xiping ; Zuo, Fengguo... - p. 1-4 , 2022
Link: https://doi.org/10.1109/CSTIC55103.2022.9856859