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1 Ergebnisse
1
Numerical Analysis of Breakdown Phenomena for Polymeric Ins..:
, In:
2022 IEEE 4th International Conference on Dielectrics (ICD)
,
Kim, Minhee
;
Kim, Su-Hun
;
Kim, Hyeong-Jun
. - p. 773-776 , 2022
Link:
https://doi.org/10.1109/ICD53806.2022.9863587
RT T1 <cTitle>2022 IEEE 4th International Conference on Dielectrics (ICD)</cTitle>: T1 <Title>Numerical Analysis of Breakdown Phenomena for Polymeric Insulators After Thermal Aging Process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9863587&Exemplar=1&LAN=DE A1 Kim, Minhee A1 Kim, Su-Hun A1 Kim, Hyeong-Jun A1 Lee, Se-Hee YR 2022 K1 Polyethylene K1 Electric breakdown K1 Photonic band gap K1 Impurities K1 Aging K1 Space charge K1 Energy states SP 773 OP 776 LK http://dx.doi.org/https://doi.org/10.1109/ICD53806.2022.9863587 DO https://doi.org/10.1109/ICD53806.2022.9863587 SF ELIB - SuUB Bremen
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