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1 Ergebnisse
1
Study of the Electrical Properties of Thin Silica Layers wi..:
, In:
2022 IEEE 4th International Conference on Dielectrics (ICD)
,
Rigoudy, C.
;
Makasheva, K.
;
Villeneuve-Faure, C.
.. - p. 273-276 , 2022
Link:
https://doi.org/10.1109/ICD53806.2022.9863598
RT T1 <cTitle>2022 IEEE 4th International Conference on Dielectrics (ICD)</cTitle>: T1 <Title>Study of the Electrical Properties of Thin Silica Layers with a Single Plane of AgNPs Embedded Near the Surface</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9863598&Exemplar=1&LAN=DE A1 Rigoudy, C. A1 Makasheva, K. A1 Villeneuve-Faure, C. A1 Teyssedre, G. A1 Boudou, L. YR 2022 K1 Silicon compounds K1 Nanoparticles K1 Silver K1 Dielectric materials K1 Surface charging K1 Conductivity K1 Dielectrics SP 273 OP 276 LK http://dx.doi.org/https://doi.org/10.1109/ICD53806.2022.9863598 DO https://doi.org/10.1109/ICD53806.2022.9863598 SF ELIB - SuUB Bremen
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