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1 Ergebnisse
1
Detachable Terahertz Chip-to-Chip Interconnectors:
, In:
2022 IEEE/MTT-S International Microwave Symposium - IMS 2022
,
Tsao, Han-Yu
;
Wang, Yuxin
;
Weikle, Robert M.
.. - p. 575-578 , 2022
Link:
https://doi.org/10.1109/IMS37962.2022.9865386
RT T1 <cTitle>2022 IEEE/MTT-S International Microwave Symposium - IMS 2022</cTitle>: T1 <Title>Detachable Terahertz Chip-to-Chip Interconnectors</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9865386&Exemplar=1&LAN=DE A1 Tsao, Han-Yu A1 Wang, Yuxin A1 Weikle, Robert M. A1 Lichtenberger, Arthur W. A1 Barker, Nicolas Scott YR 2022 SN 2576-7216 K1 Semiconductor device measurement K1 Force K1 Interference K1 Insertion loss K1 Contact resistance K1 Reliability engineering K1 Loss measurement K1 coaxial interconnects K1 THz interconnects K1 silicon micromachining SP 575 OP 578 LK http://dx.doi.org/https://doi.org/10.1109/IMS37962.2022.9865386 DO https://doi.org/10.1109/IMS37962.2022.9865386 SF ELIB - SuUB Bremen
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