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1 Ergebnisse
1
Heat-tolerant 112-Gb/s PAM4 transmission using active optic..:
, In:
2021 Opto-Electronics and Communications Conference (OECC)
,
Suda, S.
;
Kurosu, T.
;
Noriki, A.
... - p. 1-3 , 2021
Link:
https://doi.org/10.1364/OECC.2021.W3C.4
RT T1 <cTitle>2021 Opto-Electronics and Communications Conference (OECC)</cTitle>: T1 <Title>Heat-tolerant 112-Gb/s PAM4 transmission using active optical package substrate for silicon photonics co-packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9866364&Exemplar=1&LAN=DE A1 Suda, S. A1 Kurosu, T. A1 Noriki, A. A1 Tamai, I. A1 Ibusuki, Y. A1 Ukita, A. A1 Takemura, K. A1 Shimura, D. A1 Onawa, Y. A1 Yaegashi, H. A1 Aoki, T. A1 Amano, T. YR 2021 SN 2166-8892 K1 Heating systems K1 Silicon photonics K1 Optical waveguides K1 Substrates K1 Optical polymers SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1364/OECC.2021.W3C.4 DO https://doi.org/10.1364/OECC.2021.W3C.4 SF ELIB - SuUB Bremen
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