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1 Ergebnisse
1
A novel package structure for SIC power module with Kelvin ..:
, In:
11th International Conference on Power Electronics, Machines and Drives (PEMD 2022)
,
Wang, Y.
;
Zhao, D.
;
Ma, X.
.. - p. None , 2022
Link:
https://doi.org/10.1049/icp.2022.1135
RT T1 <cTitle>11th International Conference on Power Electronics, Machines and Drives (PEMD 2022)</cTitle>: T1 <Title>A novel package structure for SIC power module with Kelvin source</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9868739&Exemplar=1&LAN=DE A1 Wang, Y. A1 Zhao, D. A1 Ma, X. A1 Chen, C. A1 Tao, L. YR 2022 K1 electronics packaging K1 finite element analysis K1 modules K1 silicon compounds K1 wide band gap semiconductors K1 package structure K1 SIC power module K1 low parasitic parameters K1 high power density K1 paralleled chip K1 symmetric package K1 half-bridge SiC modules K1 quantification model K1 current averaging K1 conduction impendence K1 parasitic parameters K1 LT-Spice K1 switching losses K1 SiC SP None LK http://dx.doi.org/https://doi.org/10.1049/icp.2022.1135 DO https://doi.org/10.1049/icp.2022.1135 SF ELIB - SuUB Bremen
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