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1 Ergebnisse
1
Optimizing Thermal Properties of Thermal Interface Material..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Ding, Shengchang
;
He, Dongyi
;
Cai, Linfeng
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9872543
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Optimizing Thermal Properties of Thermal Interface Materials Using the Adhesion Mechanism of Gecko's Setae</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9872543&Exemplar=1&LAN=DE A1 Ding, Shengchang A1 He, Dongyi A1 Cai, Linfeng A1 Zeng, Xiangliang A1 Zeng, Xiaoliang A1 Ren, Linlin A1 Du, Guoping A1 Fan, Jianfeng YR 2022 K1 Adhesives K1 Thermal resistance K1 Surface resistance K1 Scattering K1 Conductivity K1 Thermal conductivity K1 Electronic packaging thermal management K1 dangling chains K1 thermal conductivity K1 thermal resistance K1 thermal interface materials SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9872543 DO https://doi.org/10.1109/ICEPT56209.2022.9872543 SF ELIB - SuUB Bremen
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