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1 Ergebnisse
1
Construction and Verification of Hyperelastic Constitutive ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Zhong, Cheng
;
Peng, Xu
;
Li, Chenglong
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9872564
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Construction and Verification of Hyperelastic Constitutive for Polymer Materials</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9872564&Exemplar=1&LAN=DE A1 Zhong, Cheng A1 Peng, Xu A1 Li, Chenglong A1 Wan, Yong-Qiang A1 Xue, Sen-Ming A1 Lu, Jibao A1 Liu, Zhi-Quan A1 Sun, Rong A1 Liu, Ning A1 Gao, Bin A1 Chang, Haijun YR 2022 K1 Analytical models K1 Mathematical models K1 Batteries K1 Finite element analysis K1 Behavioral sciences K1 Plastics K1 Reliability K1 Hyperelastic K1 constitutive K1 polymers K1 finite element analysis (FEA) K1 drop analysis SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9872564 DO https://doi.org/10.1109/ICEPT56209.2022.9872564 SF ELIB - SuUB Bremen
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