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1 Ergebnisse
1
Reliability study of Au-Al wire bond under Cl environment:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Liao, Jinzhi Lois
;
Wang, Bisheng
;
Zhang, Xi
.. - p. 1-4 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9872588
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Reliability study of Au-Al wire bond under Cl environment
UL https://suche.suub.uni-bremen.de/peid=ieee-9872588&Exemplar=1&LAN=DE A1 Liao, Jinzhi Lois A1 Wang, Bisheng A1 Zhang, Xi A1 Hua, Younan A1 Li, Xiaomin YR 2022 K1 Gold K1 High-temperature superconductors K1 Temperature K1 Corrosion K1 Wires K1 Humidity K1 Voltage K1 gold (Au) bonding wire K1 chlorin (Cl) K1 corrosion K1 intermetallic compound K1 reliability SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9872588 DO https://doi.org/10.1109/ICEPT56209.2022.9872588 SF ELIB - SuUB Bremen
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