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1 Ergebnisse
1
Characterization and Simulation of Interfacial Adhesion in ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Liu, Donghui
;
Ding, Fei
;
Su, Meiying
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9872614
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Characterization and Simulation of Interfacial Adhesion in Embedded Device Package
UL https://suche.suub.uni-bremen.de/peid=ieee-9872614&Exemplar=1&LAN=DE A1 Liu, Donghui A1 Ding, Fei A1 Su, Meiying A1 Ma, Rui A1 Chen, Chuan A1 Cao, Liqiang YR 2022 K1 Deformable models K1 Temperature measurement K1 Adhesive strength K1 Packaging K1 Finite element analysis K1 Risk management K1 Reliability K1 embedded component packages K1 reliability K1 interfacial adhesive strength K1 energy release rate SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9872614 DO https://doi.org/10.1109/ICEPT56209.2022.9872614 SF ELIB - SuUB Bremen
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