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High Thermal Assembly Solution for Large FOEB Chiplets Inte..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Lin, Hsin-Jou ; Hsu, Xi-Zhang ; Wang, Long-Yuan.. - p. 1-4 , 2022
Link: https://doi.org/10.1109/ICEPT56209.2022.9872620