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Structure and Properties of SnBi/Cu Composite Lead-free Sol..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Zhou, Jiacheng ; Zhang, Fuwen ; Wang, Zhigang... - p. 1-5 , 2022
Link: https://doi.org/10.1109/ICEPT56209.2022.9872672