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1 Ergebnisse
1
Multi-physics Simulation and Design of Paralleled Silicon C..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Gao, Lei
;
Gong, Tingrui
;
Meng, Yinghao
.. - p. 1-4 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9872697
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Multi-physics Simulation and Design of Paralleled Silicon Carbide Dual Chip Module</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9872697&Exemplar=1&LAN=DE A1 Gao, Lei A1 Gong, Tingrui A1 Meng, Yinghao A1 Yan, Xinzhu A1 Li, Juntao YR 2022 K1 Temperature distribution K1 Inductance K1 Silicon carbide K1 Layout K1 Multichip modules K1 Logic gates K1 Electronic packaging thermal management K1 SiC power module K1 SOT227 K1 Multi-physics SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9872697 DO https://doi.org/10.1109/ICEPT56209.2022.9872697 SF ELIB - SuUB Bremen
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