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1 Ergebnisse
1
Soldering of Ag-coated 5A06-Al substrates using Ni foam/SAC..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Chen, Gaiqing
;
Xiong, Cong
;
Wu, Ying
.. - p. 1-4 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9872706
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Soldering of Ag-coated 5A06-Al substrates using Ni foam/SAC305 composite solders
UL https://suche.suub.uni-bremen.de/peid=ieee-9872706&Exemplar=1&LAN=DE A1 Chen, Gaiqing A1 Xiong, Cong A1 Wu, Ying A1 Xu, Xing A1 Xiao, Yong YR 2022 K1 Nickel K1 Skeleton K1 Microstructure K1 Soldering K1 Substrates K1 Electronics packaging K1 5A06-Al K1 Ni foam/SAC305 composite solder K1 low-temperature soldering K1 microstructure K1 shear strength SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9872706 DO https://doi.org/10.1109/ICEPT56209.2022.9872706 SF ELIB - SuUB Bremen
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