I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Stress Analysis and Optimization of BGA Solder Joints Under..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Liu, Xiaobin
;
Huang, Chunyue
;
Wu, Liye
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9872735
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Stress Analysis and Optimization of BGA Solder Joints Under Thermal Fatigue Loading by Solder Joint Structural Parameters</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9872735&Exemplar=1&LAN=DE A1 Liu, Xiaobin A1 Huang, Chunyue A1 Wu, Liye A1 Wang, Lilin A1 Liu, Xianjia A1 Zhang, Huaiquan YR 2022 K1 Analytical models K1 Temperature distribution K1 Fatigue K1 Electronic packaging thermal management K1 Data models K1 Thermal analysis K1 Structural engineering K1 BGA solder joints K1 structural parameters K1 orthogonal test method K1 extreme difference analysis method K1 thermal stress SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9872735 DO https://doi.org/10.1109/ICEPT56209.2022.9872735 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
