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Microstructure and mechanical properties of Sn-Ag-Cu/Sn-Pb ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Gu, Shengxiang ; Yin, Siqi ; Huang, Mingliang - p. 1-5 , 2022
Link: https://doi.org/10.1109/ICEPT56209.2022.9872737