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1 Ergebnisse
1
Temperature test comparison of GaN devices under different ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Zha, Zhiwei
;
Zhu, Jianyuan
;
Yang, Xiaofeng
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9872740
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Temperature test comparison of GaN devices under different light source responses based on thermoreflectance thermography
UL https://suche.suub.uni-bremen.de/peid=ieee-9872740&Exemplar=1&LAN=DE A1 Zha, Zhiwei A1 Zhu, Jianyuan A1 Yang, Xiaofeng A1 Huang, Xu A1 Guo, Huaixin A1 Xie, An A1 Lu, Xiangjun A1 Fu, Zhiwei YR 2022 K1 Gold K1 Temperature distribution K1 Surface waves K1 Thermoreflectance K1 HEMTs K1 Steady-state K1 MODFETs K1 Thermoreflectance thermography K1 GaN HEMTs K1 thermoreflectance coefficient K1 passivated gold SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9872740 DO https://doi.org/10.1109/ICEPT56209.2022.9872740 SF ELIB - SuUB Bremen
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