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1 Ergebnisse
1
Chemically Integrated Ni-P Film Resistors with Controllable..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Yuefeng
;
Zhou, Guoyun
;
Ji, Linxian
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9872760
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Chemically Integrated Ni-P Film Resistors with Controllable Resistance Values on Printed Circuit Board</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9872760&Exemplar=1&LAN=DE A1 Wang, Yuefeng A1 Zhou, Guoyun A1 Ji, Linxian A1 Ma, Ziwei A1 Jiang, Qichang A1 Jia, Mingli A1 Li, Linfeng A1 Zhang, Cun A1 Sun, Huixia YR 2022 K1 Resistors K1 Shape K1 Thermal resistance K1 Surface resistance K1 Surface morphology K1 Plating K1 Real-time systems K1 integrated Ni-P film resistors K1 real-time monitoring technology K1 electroless plating K1 printed circuit board SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9872760 DO https://doi.org/10.1109/ICEPT56209.2022.9872760 SF ELIB - SuUB Bremen
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