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1 Ergebnisse
1
Effect of surface energy on the bond strength of conductive..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Zhu, Zhenghu
;
Xu, Jiuhua
;
Yu, Zhixia
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873114
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Effect of surface energy on the bond strength of conductive adhesive</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873114&Exemplar=1&LAN=DE A1 Zhu, Zhenghu A1 Xu, Jiuhua A1 Yu, Zhixia A1 Wang, Jin A1 Wu, Hairui A1 Long, Xu YR 2022 K1 Surface contamination K1 Energy measurement K1 Plasma measurements K1 Thermal conductivity K1 Cleaning K1 Pollution measurement K1 Plasmas K1 conductive adhesive K1 surface energy K1 bond strength K1 plasma cleaning K1 thermal test SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873114 DO https://doi.org/10.1109/ICEPT56209.2022.9873114 SF ELIB - SuUB Bremen
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