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Investigation on the thermo-mechanical reliability of bump ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Wu, Zhuolun
;
Wang, Weilun
;
Wang, Zhuqiu
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873129
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Investigation on the thermo-mechanical reliability of bump with different solder shape in ultra-large size FCBGA package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873129&Exemplar=1&LAN=DE A1 Wu, Zhuolun A1 Wang, Weilun A1 Wang, Zhuqiu A1 Yang, Dan A1 Mei, Na A1 Sun, Tuobei YR 2022 K1 Integrated circuits K1 Shape K1 Packaging K1 Electronic packaging thermal management K1 Fatigue K1 Finite element analysis K1 Pins K1 FCBGA K1 finite element analysis K1 bump K1 copper pillar K1 submodel SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873129 DO https://doi.org/10.1109/ICEPT56209.2022.9873129 SF ELIB - SuUB Bremen
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