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1 Ergebnisse
1
Stress simulation analysis of CIS interconnect solder joint..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Geng, Jing
;
Lv, Jun
;
Jin, Ke
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873137
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Stress simulation analysis of CIS interconnect solder joints under thermal cycling</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873137&Exemplar=1&LAN=DE A1 Geng, Jing A1 Lv, Jun A1 Jin, Ke A1 Ji, Ping A1 Li, Yongzhi A1 Xue, Yuxiong A1 Liu, Yang YR 2022 K1 Analytical models K1 Metals K1 Electronic packaging thermal management K1 Market research K1 Thermal analysis K1 Finite element analysis K1 Reliability K1 CIS K1 finite element simulation K1 solder joints K1 thermal cycling K1 stress SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873137 DO https://doi.org/10.1109/ICEPT56209.2022.9873137 SF ELIB - SuUB Bremen
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