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1 Ergebnisse
1
Enhanced thermomechanical and dielectric properties of the ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Liu, Zheng
;
Luo, Suibin
;
Chu, Baojin
. - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873140
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Enhanced thermomechanical and dielectric properties of the epoxy composites by incorporating SiO2 and BaTiO3 fillers
UL https://suche.suub.uni-bremen.de/peid=ieee-9873140&Exemplar=1&LAN=DE A1 Liu, Zheng A1 Luo, Suibin A1 Chu, Baojin A1 Yu, Shuhui YR 2022 K1 Silicon compounds K1 Thermal expansion K1 Dielectric constant K1 Epoxy resins K1 Dielectric losses K1 Packaging K1 Mechanical factors K1 Advanced packaging Materials K1 polymer-based composites K1 dielectric properties SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873140 DO https://doi.org/10.1109/ICEPT56209.2022.9873140 SF ELIB - SuUB Bremen
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